Custom PCB design for RF, mixed-signal, and high-speed digital systems. From schematic capture through layout, fabrication, and bring-up, we handle the signal integrity, power integrity, and thermal challenges that come with pushing performance in compact form factors.

Our board work spans simple sensor interfaces to complex SDR platforms with tight RF-digital integration. Enclosure design for thermal management, EMI shielding, and environmental protection. We design for manufacturability and work with fabrication partners to ensure smooth transitions from prototype to production.

Complete RF system design from architecture through production, covering front-end chains, filters, matching networks, power amplifiers, and receiver systems. We work across frequency bands from HF through W-band, with particular depth in mmWave and microwave systems for radar, communications, and sensing.

Antenna design from concept through anechoic chamber characterization, including phased arrays, conformal antennas, multiband systems, and application-specific designs for radar, communications, and direction finding. EMI/EMC compliance per DO-160, MIL-STD-461, and MIL-HDBK-516C for programs requiring flight certification.

Low-temperature co-fired ceramic design, fabrication, and integration for high-frequency, high-reliability RF modules. LTCC enables multilayer packaging with embedded passives, high-density interconnects, and excellent thermal management, making it the substrate of choice for demanding mmWave and aerospace applications.

We design LTCC modules from scratch and rework existing assemblies to improve yield or repair failed components without full re-fabrication. Our LTCC experience includes W-band and K-band radar front-ends, beamforming networks, antenna feed structures, and hermetic packaging for space-qualified systems.